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Tantalum Foil in Electronic Capacitors: High-Voltage, High-Capacitance Technology Key to Breakthroughs

The electronics sector accounts for over 60% of global tantalum foil demand. With the expansion of high-end applications like 5G base stations and automotive electronics, performance requirements for tantalum electrolytic capacitors continue to rise. Traditional tantalum foil anodes struggle to meet high-voltage and high-frequency demands due to their disordered pore structure and high leakage current. However, the breakthrough of the synergistic "flash Joule heating - pulse etching" technology has reshaped this landscape.

This technology uses a 6-second, instantaneous high-temperature (>2000°C) coating of 50nm nano-tantalum powder onto a substrate, forming an ordered porous structure. This pore structure is then precisely expanded through 30 minutes of 5V pulse etching, resulting in an 11.4-fold increase in the area-to-capacitance of the tantalum foil, reaching 243.6nF/mm², while reducing leakage current to one-fifth that of commercial products. This high-performance tantalum foil has achieved a 100V high-voltage withstand capability and over 95% performance retention after 1000 hours of high-temperature storage. Market data indicates that demand for tantalum foil in the electronics sector will increase to 80,000 tons by 2025, a 6% annual increase. Companies are accelerating technology transfer. For example, Shenzhen Zhongke Jingyan has launched an integrated production line with a single furnace processing capacity of 1 ton per day, driving the large-scale penetration of this technology into applications such as 5G radio frequency capacitors.